| “Development
of organic and inorganic flexible optoelectronic devices”
CAPES/GRICES (2003/2007).
Partners: DCM/FCTUNL; CEMOP (UNINOVA); USP (Brazil)
Responsible: E. Fortunato.
This project aims the production
and study of hybrid organic and inorganic flexible optoelectonic
devices such as OLED’s, thin film transistors
and photodiodes for applications such as in displays,
sensors for biological and food control systems, etc.
“Materials
Engineering and Physics of Quasimorphous Silicon Thin
Films for its Application in Large Area Electronics”
Fundação Luso Americana para o Desenvolvimento,
FLAD and U.S.A. National Science Foundation(project
85/02, 2002/2004).
Partners: CEMOP/ UNINOVA, CENIMAT (Portugal), Physics
Department of Syracuse University (USA).
Responsible: R. Martins and I. Ferreira
The subject matter of this project
is in multidisciplinary area, involving elements of
Physics, Chemistry, Chemical Engineering and Materials
Science, specifically it is concerned with synthesis
and understanding of structural-electronic properties
correlation and metastable behaviour of nanostructured
silicon thin-film (quasimorphous, qm-Si:H), a new class
of non-crystalline silicon-based thin-film semiconductor
aiming to improve the know-how about its properties
and to exploit its field of applications.
“European
Network on Amorphous-Silicon Device Technology-ASINET”
Brite-EuRam, GTC1-2000-28040 (2000/2004).
Partners: CIEMAT (ES), coordinator; ENEA (IT); U. Cranfield
(UK); Pilkington (UK); U. Barcelona (ES); CNRS/PICM
(FR); Akzo Nobel b.v./ANC (NL); CNR (IT); U. Stuttgart
(DE); IST (PT); LAMEL (IT); U. Torino (IT); U. Patras
(GR); U. Delft/TUE (NL); UNINOVA/CEMOP (PT); U. Cambridge
(UK); U. Utrecht (NL); U. Roma (IT); TNO (NL).
Duration: 02/00 to 05/2004.
Responsible: R. Martins, E. Fortunato
The present project is aimed at
the creation of an European Network on Amorphous-Silicon
Device Technology. The initiative has been inspired
on the exist know-how in Europe in this field and in
the need of Europe to be present in further developments
concerning the application of this technology.
“Development
of new production techniques for highly efficient polymorphous
solar cells – H-Alpha Solar”
Brite-EuRam, NNE5-1999-00133
Partners: U. Eindhoven/TUE (NL, coordinator), U. Orleans/GREMI
(FR); CNRS/PICM (FR); UNINOVA/CEMOP (PT); ATECNIC/PORTSOL
(PT); Balzers A. G./BPS (LI); Akzo Nobel Chemical b.v./ANC
(NL).
Duration: 04/2000 a 08/2004.
Responsible: R. Martins
In this project, new production
technologies will be developed for the production of
highly efficient and cost effective solar cells based
on the application of the innovative polymorphous silicon
material. The material and the production processes
will be optimised by the participating research groups
and transferred to medium scale pilot lines in the manufacturing
industry. Both in-line batch processes and continuous
roll-to-roll processes will be addressed. At the end
of the project, a perspective to large-scale industrial
production at a cost lower than 1 Euro/Wp will be created.
“European
Masters on Renewable Energy”
XVII/4.1030/Z/98-166
Partners: EUREC Agency; U. Loughborough; U. Nova de
Lisbon; U. Northumbria; Technical U. Athens; U. Saragoça;
U. Kassel; U. Córsega, École dês
Mines de Paris; U. Athens.
Starting: October 2002
Responsible: L. Guimarães and E. Fortunato
“University
Science Park – Organizational Framework (USP)”
TEMPUS UM _ JEP-16090-2001.
Partners: U. T. Vienna (coordinator); U. Novi Sad –
Yugoslavia; U. Belgrade – Yugoslavia; U. Banja
Luka – Bosnia Yergozinia; MITOS S.A. – Greece;
U. Middlesex – U.K. ; IVAM NRW e.V. – Germany;
CENIMAT – Portugal; U.T. Delft – NL.
Duration: 3 years
Responsible: E. Fortunato
To establish a road map concerning
the establishment of science park in Yugoslavia with
technical and scientific links to some well known European
institutes working in several engineering fields, including
materials science and engineering
“Innovative
solar modules using the entire spectrum of the sunlight
by concentration and dispersion”
JOR3-CT98_7001
Partners: MBB (DE, coordinator); Photowatt (FR); FCTUNL
(PT).
Duration: 05/1999 to 12/2003.
Responsible: L. Guimarães
The aim of this project is to define
processes that lead to the enhancement of light collection
on solar cell modules (crystalline or not), for industrial
applications.
“Inspection
of large soldered joints and optimisation of soldering
process - LASOL”
Brite-EuRam, BRE-CT97-4689
Partners: AEG (DE, coordinator); JENOPTKIS (DE); FERBV
(DE), Fraunhoffer Inst. (DE); NMRC (IRL); TEKELEC (PT);
UNINOVA/CEMOP (PT).
Duration: 09/1998 a 06/2003.
Responsible: R. Martins and F. Soares
Vision systems for 3D inspection
find application in a wide variety of industries, besides
the ones related to inspect and to control quality of
large size soldering joins, as it is the purpose of
the LASOL project.
The aim is to develop the tools of an inspection system
to provide significant increases in resolution and speed
of data capture, compared with conventional CCD camera
systems. Here, the operation principle behind the technique
is to allow that the X ray produced will impinge a centillator
(to protect operators and to allow an indirect detection
process) that will emit light which will be captured
by a detector (e.g. a photodiode connected to a switch
matrix, to provide information on the spot position
considered), as shown in the sketches below.
“Co-ordination
of microelectronics packaging and interconnection projects:
Environment and trends for the development of European
solutions - COMPETE”
thematic network BETC-1013/97
Partners: MTA (FR, coordenador); Alcatel (FR); Siemens
(DE); ABB (DE); Phillips (NL); Thomson (FR); Bosch (DE);
CEMOP (PT); NMRC (IRL); IMEC (BE); SEAT (SP); RCA (GB);
Osprey Metals (NL); MMC Packages (GB); NMRC (IRL); IMEC
(BE); INESC (PT); UNINOVA/CEMOP (PT); BULL (DK); CNM
(SP); Ericsson (SE); DASSAULT (FR); GEC MARCONI (GB);
MATRA (FR); VTT (FL); Smartpack Tecnol. (IT); CIEMAT
(SP); Heraeus (DE).
Duration: 01/1998 to 06/2003
Responsible: Profs. R. Martins, E. Fortunato.
The aim of this network is
to establish an European road map concerning problems
related to interconnection and packaging in electronics
aiming to solve the challenging issues in terms of miniaturisation,
heat dissipation, frequency increase, functionality
integration through multiple layers, embedded components.
The network, initially structured around a few working
groups, expanded progressively under the impulse of
the members to a structured environment counting to
date 9 working groups, covering the major issues in
P&I for the European industry, most of them involved
in this network
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